With the emergence of new technical trends such as Internet of Things, Big Data, wearable electronics, automotive electronics, and 3-D printing, the role of electrical design of packages and package-based systems is more important than ever. In addition to ongoing challenges to achieve higher integration density along with maintaining electrical integrity, multiphysics and low-power design requirements should be addressed. In order to provide solutions for upcoming applications and design challenges, novel ideas on design as well as advanced modeling approaches are continuously demanded.