Browse "RIMS Collection" by Subject CVD
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| EFFECTS OF DEPOSITION RATE ON THE ENCROACHMENT IN TUNGSTEN FILMS REDUCED BY H-2 PARK, YW; KIM, IL; Park, Chong-Ook; Chun , Soung Soon, JOURNAL OF MATERIALS SCIENCE, v.26, no.19, pp.5318 - 5322, 1991-10 |
| Effects of Deposition Temperature on the microstructure of MOCVD Y1Ba2Cu3O7-x Thin-Films Cho, CY; Hwang, D; No, Kwangsoo; Chun , Soung Soon; Kim, SH, JOURNAL OF MATERIALS SCIENCE, v.28, no.11, pp.2915 - 2922, 1993-06 |
| THE ADHESION OF LOW-PRESSURE CHEMICALLY VAPOR-DEPOSITED TUNGSTEN FILMS ON SILICON AND SIO2 FOR SIH4-H2-WF6 AND H2-WF6 PROCESSES PARK, YW; Park, Chong-Ook; Chun , Soung Soon, THIN SOLID FILMS, v.201, no.1, pp.167 - 175, 1991-06 |
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