Showing results 1 to 6 of 6
A new type of high entropy alloy composite Fe18Ni23Co25Cr21Mo8WNb3C2 prepared by mechanical alloying and hot pressing sintering Sun, Chongfeng; Li, Panpan; Xi, Shengqi; Zhou, Yun; Li, Shengwen; Yang, Xigang, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.728, pp.144 - 150, 2018-06 |
Effects of the annealing in Ar and H-2/Ar ambients on the microstructure and the electrical resistivity of the copper film prepared by chemical vapor deposition Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun , Soung Soon, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.11, pp.5781 - 5786, 1996-11 |
Fabrication of superconducting MgB2 thin films on textured Cu(100) tape by hybrid physical-chemical vapor deposition Lee T.G.; Ranot M.; Seong W.K.; Jung S.-G.; Kang W.N.; Joo J.H.; Kim C.-J.; et al, SUPERCONDUCTOR SCIENCE & TECHNOLOGY, v.22, no.4, 2009 |
Low temperature copper etching using an inductively coupled plasma with ultraviolet light irradiation Choi, KS; Han, Chul-Hi, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.145, no.3, pp.37 - 39, 1998-03 |
Low-Temperature Plasma Etching of Copper Films Using Ultraviolet Irradiation Kang-Sik Choi; Chul-Hi Han, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1, v.37, no.11, pp.5945 - 5948, 1998-11 |
Reactive ion etching mechanism of copper film in chlorine-based electron cyclotron resonance plasma Lee, SK; Chun , Soung Soon; Hwang, CY; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.1A, pp.50 - 55, 1997-01 |
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