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Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM Lu M.; Lauro P.; Shih D.-Y.; Polastre R.; Goldsmith C.; Henderson D.W.; Zhang H.; et al, 2008 58th Electronic Components and Technology Conference, ECTC, pp.360 - 365, 2008-05-27 |
Topology optimization of steady-state heat conduction problems with design-dependent heat loads Zhang H.; Liu S.; Zhang X., ZHONGGUO JIXIE GONGCHENG/CHINA MECHANICAL ENGINEERING, v.20, no.11, pp.1339 - 1343, 2009-06 |
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