Browse "RIMS Collection" by Author Rha J.-J.
Showing results 1 to 1 of 1
| Low Temperature Two-Step Atomic Layer Deposition of Tantalum Nitride for Cu Diffusion Barrier Kwon J.-D.; Jeong S.-J.; Kang J.-W.; Kim D.-G.; Kim J.-K.; Rha J.-J.; Nam K.-S.; et al, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.156, no.11, pp.H832 - H835, 2009 |
Discover
Type
- 4,829 Article
- 3,515 Conference
- 1,493 Patent
- 2 Thesis(Master)
Open Access
- 223 OA Article
Date issued
- 1,338 2020 - 2024
- 2,945 2010 - 2019
- 2,339 2000 - 2009
- 1,846 1990 - 1999
- 579 1980 - 1989
- 3 1964 - 1969