Browse "RIMS Collection" by Author Rha J.-J.
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| Low Temperature Two-Step Atomic Layer Deposition of Tantalum Nitride for Cu Diffusion Barrier Kwon J.-D.; Jeong S.-J.; Kang J.-W.; Kim D.-G.; Kim J.-K.; Rha J.-J.; Nam K.-S.; et al, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.156, no.11, pp.H832 - H835, 2009 |
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