Browse "RIMS Collection" by Author Puttlitz K.J.
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| Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents Kang S.K.; Lauro P.; Shih D.-Y.; Henderson D.W.; Gosselin T.; Bartelo J.; Cain S.R.; et al, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.661 - 667, 2004-06-01 |
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