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Heat sink design for a thermoelectric cooling system Han H.S.; Kim S.Y.; Ji T.H.; Jee Y.-J.; Lee D.; Jang K.S.; Oh D.H., 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM, pp.1222 - 1230, 2008-05-28 |
Transformation mechanism of n-butyl terminated Si nanoparticles embedded into Si1-xCx nanocomposites mixed with Si nanoparticles and C atoms Shin J.W.; Oh D.H.; Kim T.W.; Cho W.J., APPLIED SURFACE SCIENCE, v.255, no.9, pp.5067 - 5070, 2009 |
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