Browse "RIMS Collection" by Author 박미영
Showing results 6 to 6 of 6
| 플립칩 본딩을 통한 ３차원 적층 패키지 및 그 제조방법 채장수; 박미영; 조희근; 유광선 |
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Type
- 4,830 Article
- 3,515 Conference
- 1,493 Patent
- 2 Thesis(Master)
Open Access
- 223 OA Article
Date issued
- 1,339 2020 - 2024
- 2,945 2010 - 2019
- 2,339 2000 - 2009
- 1,846 1990 - 1999
- 579 1980 - 1989
- 3 1964 - 1969