DC Field | Value | Language |
---|---|---|
dc.contributor.author | 백경욱 | ko |
dc.date.accessioned | 2017-12-20T11:17:21Z | - |
dc.date.available | 2017-12-20T11:17:21Z | - |
dc.date.issued | 2001-05-01 | - |
dc.identifier.uri | http://hdl.handle.net/10203/233774 | - |
dc.description.abstract | Disclosed is a method of preparing anisotropic conductive adhesives for flip chip interconnection on organic substrates, in which an epoxy resin as a binder is mixed with a conductive material and a non-conductive material at room temperature for 3 hours and then, with a coupling agent and a curing agent at room temperature for 1 hour. The anisotropic conductive adhesives are endowed with the electrical conductivity of conventional anisotropic conductive films and the mechanical reliability of an underfill used in a solder flip chip, simultaneously. The ACA shows fast hardenability and excellent coating and screening properties. The adhesive is spread over a plastic printed circuit board into which a flip chip is then brought. The flip chip and the plastic substrate can be bonded to each other using heat and pressure. Also, it is applicable for low-price flip chips and chip size packaging as well as for relevant-assembly packaging. | - |
dc.title | Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | 백경욱 | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 09506708 | - |
dc.identifier.patentRegistrationNumber | 6238597 | - |
dc.date.application | 2000-02-18 | - |
dc.date.registration | 2001-05-01 | - |
dc.publisher.country | US | - |
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