High adhesion triple layered anisotropic conductive adhesive film
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 백경욱 | ko |
| dc.date.accessioned | 2017-12-20T11:17:14Z | - |
| dc.date.available | 2017-12-20T11:17:14Z | - |
| dc.date.issued | 2005-04-12 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/233770 | - |
| dc.description.abstract | Disclosed is a triple layered ACA film adapted for enhancing the adhesion strength of a typical single layer Anisotropic Conductive Film or for enhancing the adhesion strength of the ACA film in flip chip bonding. The triple layered ACA film of the invention comprises: a main ACA film based upon epoxy resin and containing conductive particles having a particle size of 3 to 10 μm and optionally non-conductive particles having a particle size of 0.1 to 1 μm; and adhesion reinforcing layers based upon epoxy resin and formed at both sides of the main ACA film. | - |
| dc.title | High adhesion triple layered anisotropic conductive adhesive film | - |
| dc.type | Patent | - |
| dc.type.rims | PAT | - |
| dc.contributor.localauthor | 백경욱 | - |
| dc.contributor.assignee | KAIST | - |
| dc.identifier.iprsType | 특허 | - |
| dc.identifier.patentApplicationNumber | 10193264 | - |
| dc.identifier.patentRegistrationNumber | 6878435 | - |
| dc.date.application | 2002-07-12 | - |
| dc.date.registration | 2005-04-12 | - |
| dc.publisher.country | US | - |
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