DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김정호 | ko |
dc.date.accessioned | 2017-12-20T10:27:12Z | - |
dc.date.available | 2017-12-20T10:27:12Z | - |
dc.date.issued | 2011-06-21 | - |
dc.identifier.uri | http://hdl.handle.net/10203/232487 | - |
dc.description.abstract | The present invention is to implement a SOP of a mobile RFID interrogator. The substrate has external connection terminal patterns on a first surface of a substrate and circuit wiring patterns on a second surface of the substrate. a high frequency front-end part, a power amplifier IC, an analog-digital signal processing chip and the like are mounted on the second surface. The high frequency front-end part is to transmit and receive a RFID signal. The power amplifier IC is to output an amplified high frequency transmission signal to the high frequency front-end part. The analog-digital signal processing chip is to output a high frequency transmission signal to the power amplifier IC and process the RFID signal received through the high frequency front-end part, a mold resin is to cover the second surface and components mounted on the second surface for electrical insulation from outside and physical protection from outside. | - |
dc.title | System on package of a mobile RFID interrogator | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | 김정호 | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 11741946 | - |
dc.identifier.patentRegistrationNumber | 7964944 | - |
dc.date.application | 2007-04-30 | - |
dc.date.registration | 2011-06-21 | - |
dc.publisher.country | US | - |
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