System on package of a mobile RFID interrogator

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dc.contributor.author김정호ko
dc.date.accessioned2017-12-20T10:27:12Z-
dc.date.available2017-12-20T10:27:12Z-
dc.date.issued2011-06-21-
dc.identifier.urihttp://hdl.handle.net/10203/232487-
dc.description.abstractThe present invention is to implement a SOP of a mobile RFID interrogator. The substrate has external connection terminal patterns on a first surface of a substrate and circuit wiring patterns on a second surface of the substrate. a high frequency front-end part, a power amplifier IC, an analog-digital signal processing chip and the like are mounted on the second surface. The high frequency front-end part is to transmit and receive a RFID signal. The power amplifier IC is to output an amplified high frequency transmission signal to the high frequency front-end part. The analog-digital signal processing chip is to output a high frequency transmission signal to the power amplifier IC and process the RFID signal received through the high frequency front-end part, a mold resin is to cover the second surface and components mounted on the second surface for electrical insulation from outside and physical protection from outside.-
dc.titleSystem on package of a mobile RFID interrogator-
dc.typePatent-
dc.type.rimsPAT-
dc.contributor.localauthor김정호-
dc.contributor.assigneeKAIST-
dc.identifier.iprsType특허-
dc.identifier.patentApplicationNumber11741946-
dc.identifier.patentRegistrationNumber7964944-
dc.date.application2007-04-30-
dc.date.registration2011-06-21-
dc.publisher.countryUS-
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EE-Patent(특허)
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