METAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF

Abstract

A package substrate, a manufacturing method thereof, a base package module (200), and a multi-layered package module having package substrates (100a, 100b, 100c) laminated on upper and lower portions of a base package module (200) are provided. The base package module (200) includes a base metal substrate (40), a first metal oxide layer (44) that is formed on the base metal substrate to have a cavity (47) therein, a device (48) that is mounted in the cavity (47) on the base metal substrate (200) and insulated by the first metal oxide layer (44) formed on a sidewall in the cavity (47), and a conductor (50) that is connected to the device (48) and a wiring pad (61 ) formed on the first metal oxide layer (44) on the base metal substrate (200). The package substrate includes a wiring pad (61 ), a conductor line (50), a second metal oxide layer (18) having an opening (22) that exposes a device (48), and a via (20) that is connected to the wiring pad (61 ) through a connection pad (62) in the second metal oxide layer (18).