Method for measuring a thickness profile and a refractive index using white-light scanning interferometry and recording medium therefor

Abstract

A method and a recording medium for measuring three-dimensional thickness profile and refractive index of transparent dielectric thin-film with some patterns or not, which is fabricated in the semiconductor and related industrial field, using white-light scanning interferometry is provided.A method for measuring a thickness profile using white-light scanning interferometry in optical system includes the following steps. A first step is to extracting a phase graph by acquiring an interference signal and performing Fourier transform. A second step is to extracting a mathematical phase graph through modeling of a measurement object. And a third step is to measuring a profile value and a thickness value by applying an optimization technique to an error function determined by using phase values which is acquired from said first step and said second step.