DC Field | Value | Language |
---|---|---|
dc.contributor.author | 이정주 | ko |
dc.date.accessioned | 2017-12-20T04:54:38Z | - |
dc.date.available | 2017-12-20T04:54:38Z | - |
dc.date.issued | 2012-01-10 | - |
dc.identifier.uri | http://hdl.handle.net/10203/231038 | - |
dc.description.abstract | Disclosed are a crack measuring method that may automatically measure crack growth in a surface of a structure rapidly and exactly without influencing the structure using image processing scheme, and an apparatus thereof. The crack measuring method includes: irradiating light to a surface of a structure; converting reflected light, wherein the irradiated light is reflected from the surface of a structure, into an image signal and capturing images of the surface of a structure corresponding to the image signal at predetermined scan intervals through a camera; performing continuously a line scan on the crack parts in the captured images at predetermined scan intervals; and inspecting crack growth in the surface of a structure by identifying pixels with relatively higher or lower light intensity in the scan lines. | - |
dc.title | Crack measuring method and apparatus | - |
dc.title.alternative | 균열 측정 방법 및 측정 장치 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | 이정주 | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 12476874 | - |
dc.identifier.patentRegistrationNumber | 08094922 | - |
dc.date.application | 2009-06-02 | - |
dc.date.registration | 2012-01-10 | - |
dc.publisher.country | US | - |
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