DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | ko |
dc.date.accessioned | 2011-03-24T02:09:29Z | - |
dc.date.available | 2011-03-24T02:09:29Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-07 | - |
dc.identifier.citation | JOURNAL OF SOLID MECHANICS AND MATERIALS ENGINEERING, v.4, no.6, pp.639 - 651 | - |
dc.identifier.issn | 1347-5363 | - |
dc.identifier.uri | http://hdl.handle.net/10203/22959 | - |
dc.description.abstract | This paper discusses the reliability assessment of advanced structures such as micro/nano structures, electronics packaging for modern electronic devices, high temperature structures such as nuclear power plants, rocket engines for space application. Characterization of advanced materials includes free-standing electrodeposited nano-crystalline nickel thin film, polysilicon, and piezoelectric thin film for MEMS/nano structures. Lead-free solders under pseudo-power cyclic thermal loading, impact loading and mechanical bending loading were evaluated for reliability assessment of the advanced electronic packaging. Reliability assessment of Cu/SnAg double bump structures was performed for the 150μm pitch flip chip electronic packaging application. The 316L austenitic stainless steel for high-temperature components application such as in the primary side of liquid metal cooled fast breeder reactor (LMFBR) was tested under various temperatures where dynamic strain ageing occurs. The effects of dynamic strain ageing on the tensile behavior and fatigue behavior of 316L stainless steel have been identified. | - |
dc.description.sponsorship | This work has been supported by the core research program of National Research Foundation of Korea, and BK21 program of the Ministry of Education, Science and Technology of Korea. Contributions by Dr. D. C. Baek, Mr. M. Kim for thin film research, Dr. I. Kim, Dr. T. S. Park, Dr. S. Y. Yang, Dr. S. J. Ham, and Miss J. Y. Yoon for electronics packaging research, and Dr. S. G. Hong, Dr. K. O. Lee, Dr. S. S. Yoon for research on high temperature structures are greatly appreciated. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | JSME | - |
dc.title | Reliability Assessment of Advanced Materials and Structures | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.citation.volume | 4 | - |
dc.citation.issue | 6 | - |
dc.citation.beginningpage | 639 | - |
dc.citation.endingpage | 651 | - |
dc.citation.publicationname | JOURNAL OF SOLID MECHANICS AND MATERIALS ENGINEERING | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
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