NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC MATERIALS그것의 감도가 압전 물질을 사용해 개선하는 접착식으로 접착된 구조를 위한 비파괴적 신뢰도 감시 방법

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 255
  • Download : 0
DC FieldValueLanguage
dc.contributor.author이대길ko
dc.contributor.author진우석ko
dc.contributor.author황희윤ko
dc.contributor.author이승민ko
dc.contributor.author김병철ko
dc.contributor.author권재욱ko
dc.date.accessioned2017-12-20T01:16:28Z-
dc.date.available2017-12-20T01:16:28Z-
dc.date.issued2011-10-26-
dc.identifier.urihttp://hdl.handle.net/10203/229421-
dc.titleNONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURES WHOSE SENSITIVITY IS IMPROVED BY USING PIEZOELECTRIC MATERIALS-
dc.title.alternative그것의 감도가 압전 물질을 사용해 개선하는 접착식으로 접착된 구조를 위한 비파괴적 신뢰도 감시 방법-
dc.typePatent-
dc.type.rimsPAT-
dc.contributor.localauthor이대길-
dc.contributor.nonIdAuthor진우석-
dc.contributor.nonIdAuthor황희윤-
dc.contributor.nonIdAuthor이승민-
dc.contributor.nonIdAuthor김병철-
dc.contributor.nonIdAuthor권재욱-
dc.contributor.assigneeKAIST-
dc.identifier.iprsType특허-
dc.identifier.patentApplicationNumberEP05726870.8-
dc.identifier.patentRegistrationNumberEP1815237-
dc.date.application2007-05-21-
dc.date.registration2011-10-26-
dc.publisher.countryFR-
Appears in Collection
ME-Patent(특허)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0