Ground Guard Structure to Reduce the Crosstalk Noise and Electromagnetic Interference (EMI) in a Vertical Probe Card for Wafer-level Testing

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dc.contributor.authorKim, Joung-Hoko
dc.contributor.authorLee, Eunjungko
dc.contributor.authorLee, Manhoko
dc.contributor.authorKim, Jonghoon J.ko
dc.contributor.authorKim, Mijooko
dc.contributor.authorKim, Jonghoonko
dc.contributor.authorPark, Jeoungkunko
dc.contributor.authorJoo, Younghoonko
dc.contributor.authorBang, Yoonheeko
dc.contributor.authorKim, Ilko
dc.contributor.authorNam, Seungkiko
dc.date.accessioned2017-10-23T02:33:31Z-
dc.date.available2017-10-23T02:33:31Z-
dc.date.created2014-11-26-
dc.date.created2014-11-26-
dc.date.created2014-11-26-
dc.date.issued2014-08-03-
dc.identifier.citation2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI)-
dc.identifier.urihttp://hdl.handle.net/10203/226565-
dc.languageEnglish-
dc.publisher2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI)-
dc.titleGround Guard Structure to Reduce the Crosstalk Noise and Electromagnetic Interference (EMI) in a Vertical Probe Card for Wafer-level Testing-
dc.typeConference-
dc.identifier.wosid000393471300049-
dc.identifier.scopusid2-s2.0-84931827649-
dc.type.rimsCONF-
dc.citation.publicationname2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI)-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationRaleigh Convention Center, Raleigh, NC-
dc.contributor.localauthorKim, Joung-Ho-
dc.contributor.nonIdAuthorLee, Eunjung-
dc.contributor.nonIdAuthorLee, Manho-
dc.contributor.nonIdAuthorKim, Jonghoon J.-
dc.contributor.nonIdAuthorKim, Mijoo-
dc.contributor.nonIdAuthorKim, Jonghoon-
dc.contributor.nonIdAuthorPark, Jeoungkun-
dc.contributor.nonIdAuthorJoo, Younghoon-
dc.contributor.nonIdAuthorBang, Yoonhee-
dc.contributor.nonIdAuthorKim, Il-
dc.contributor.nonIdAuthorNam, Seungki-
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