Bump-less High Speed Channel on Silicon, Organic and Glass Interposer

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dc.contributor.authorKim, Joung-Hoko
dc.contributor.authorLee, Hyunsukko
dc.contributor.authorKim, Heegonko
dc.contributor.authorKim, Kiyeongko
dc.contributor.authorJung, Daniel H.ko
dc.contributor.authorKim, Jonghoon J.ko
dc.contributor.authorChoi, Suminko
dc.contributor.authorLim, Jaeminko
dc.contributor.authorKim, Hyungsooko
dc.contributor.authorPark, Kunwooko
dc.date.accessioned2017-10-23T02:33:28Z-
dc.date.available2017-10-23T02:33:28Z-
dc.date.created2014-11-26-
dc.date.issued2014-08-05-
dc.identifier.citation2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SIPI)-
dc.identifier.urihttp://hdl.handle.net/10203/226563-
dc.languageEnglish-
dc.publisher2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SIPI)-
dc.titleBump-less High Speed Channel on Silicon, Organic and Glass Interposer-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SIPI)-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationRaleigh Convention Center, Raleigh, NC-
dc.contributor.localauthorKim, Joung-Ho-
dc.contributor.nonIdAuthorLee, Hyunsuk-
dc.contributor.nonIdAuthorKim, Heegon-
dc.contributor.nonIdAuthorKim, Kiyeong-
dc.contributor.nonIdAuthorJung, Daniel H.-
dc.contributor.nonIdAuthorKim, Jonghoon J.-
dc.contributor.nonIdAuthorChoi, Sumin-
dc.contributor.nonIdAuthorLim, Jaemin-
dc.contributor.nonIdAuthorKim, Hyungsoo-
dc.contributor.nonIdAuthorPark, Kunwoo-
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