DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Joung-Ho | ko |
dc.contributor.author | Song, JW | ko |
dc.contributor.author | Kim, Sukjin | ko |
dc.contributor.author | Bae, Bumhee | ko |
dc.contributor.author | Kim, Hongseok | ko |
dc.contributor.author | Kim, Jonghoon J. | ko |
dc.contributor.author | Kim, Dong-Hyun Bill | ko |
dc.date.accessioned | 2017-09-25T05:44:03Z | - |
dc.date.available | 2017-09-25T05:44:03Z | - |
dc.date.created | 2014-11-26 | - |
dc.date.created | 2014-11-26 | - |
dc.date.created | 2014-11-26 | - |
dc.date.issued | 2014-10-26 | - |
dc.identifier.citation | 23rd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2014) | - |
dc.identifier.uri | http://hdl.handle.net/10203/226068 | - |
dc.language | English | - |
dc.publisher | 23rd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2014) | - |
dc.title | Analysis of Wireless Power Transfer System Design on Active Silicon Interposer for Low Voltage Applications in 3D-IC | - |
dc.type | Conference | - |
dc.identifier.wosid | 000380408900050 | - |
dc.identifier.scopusid | 2-s2.0-84988260195 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 23rd Conference on Electrical Performance of Electronic Packaging and Systems(EPEPS2014) | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Embassy Suites Portland | - |
dc.contributor.localauthor | Kim, Joung-Ho | - |
dc.contributor.nonIdAuthor | Song, JW | - |
dc.contributor.nonIdAuthor | Kim, Sukjin | - |
dc.contributor.nonIdAuthor | Bae, Bumhee | - |
dc.contributor.nonIdAuthor | Kim, Hongseok | - |
dc.contributor.nonIdAuthor | Kim, Jonghoon J. | - |
dc.contributor.nonIdAuthor | Kim, Dong-Hyun Bill | - |
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