Nanofluidic chip for liquid TEM cell fabricated by parylene and silicon nitride direct bonding

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dc.contributor.authorJang, Heejunko
dc.contributor.authorKang, Il-Sukko
dc.contributor.authorKim, Jihyeko
dc.contributor.authorKim, Jonghyunko
dc.contributor.authorCha, Yun Jeongko
dc.contributor.authorYoon, Dong Kiko
dc.contributor.authorLee, Wonheeko
dc.date.accessioned2017-09-08T05:59:30Z-
dc.date.available2017-09-08T05:59:30Z-
dc.date.created2017-09-04-
dc.date.created2017-09-04-
dc.date.created2017-09-04-
dc.date.created2017-09-04-
dc.date.issued2017-09-
dc.identifier.citationNANOTECHNOLOGY, v.28, no.37, pp.1361 - 6528-
dc.identifier.issn0957-4484-
dc.identifier.urihttp://hdl.handle.net/10203/225803-
dc.description.abstractDespite the importance of nanofluidic transmission electron microscope (TEM) chips, a simple fabrication method has yet to be developed due to the difficulty of wafer bonding techniques using a nanoscale thick bonding layer. We present a simple and robust wafer scale bonding technique using parylene as a bonding layer. A nanoscale thick parylene layer was deposited on a silicon nitride (SiN) wafer and patterned to construct nanofluidic channels. The patterned parylene layer was directly bonded to another SiN wafer by thermal surface activation and bonding, with a bonding strength of similar to 3 MPa. Fourier transform infrared spectroscopy showed that carbon- oxygen bonds were generated by thermal activation. We demonstrated TEM imaging of gold nanoparticles suspended in liquid using the fabricated nanofluidic chip.-
dc.languageEnglish-
dc.publisherIOP PUBLISHING LTD-
dc.titleNanofluidic chip for liquid TEM cell fabricated by parylene and silicon nitride direct bonding-
dc.typeArticle-
dc.identifier.wosid000408168200001-
dc.identifier.scopusid2-s2.0-85028383512-
dc.type.rimsART-
dc.citation.volume28-
dc.citation.issue37-
dc.citation.beginningpage1361-
dc.citation.endingpage6528-
dc.citation.publicationnameNANOTECHNOLOGY-
dc.identifier.doi10.1088/1361-6528/aa8196-
dc.contributor.localauthorYoon, Dong Ki-
dc.contributor.localauthorLee, Wonhee-
dc.contributor.nonIdAuthorKang, Il-Suk-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorliquid TEM cell-
dc.subject.keywordAuthorwafer bonding-
dc.subject.keywordAuthorparylene-
dc.subject.keywordAuthorthermal activation-
dc.subject.keywordPlusTRANSMISSION ELECTRON-MICROSCOPY-
dc.subject.keywordPlusWET-CELL-
dc.subject.keywordPlusNANOPARTICLES-
dc.subject.keywordPlusPRESSURE-
dc.subject.keywordPlusTEMPERATURE-
dc.subject.keywordPlusPLATFORM-
dc.subject.keywordPlusPLASMA-
dc.subject.keywordPlusSYSTEM-
dc.subject.keywordPlusFILMS-
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