DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jang, Heejun | ko |
dc.contributor.author | Kang, Il-Suk | ko |
dc.contributor.author | Kim, Jihye | ko |
dc.contributor.author | Kim, Jonghyun | ko |
dc.contributor.author | Cha, Yun Jeong | ko |
dc.contributor.author | Yoon, Dong Ki | ko |
dc.contributor.author | Lee, Wonhee | ko |
dc.date.accessioned | 2017-09-08T05:59:30Z | - |
dc.date.available | 2017-09-08T05:59:30Z | - |
dc.date.created | 2017-09-04 | - |
dc.date.created | 2017-09-04 | - |
dc.date.created | 2017-09-04 | - |
dc.date.created | 2017-09-04 | - |
dc.date.issued | 2017-09 | - |
dc.identifier.citation | NANOTECHNOLOGY, v.28, no.37, pp.1361 - 6528 | - |
dc.identifier.issn | 0957-4484 | - |
dc.identifier.uri | http://hdl.handle.net/10203/225803 | - |
dc.description.abstract | Despite the importance of nanofluidic transmission electron microscope (TEM) chips, a simple fabrication method has yet to be developed due to the difficulty of wafer bonding techniques using a nanoscale thick bonding layer. We present a simple and robust wafer scale bonding technique using parylene as a bonding layer. A nanoscale thick parylene layer was deposited on a silicon nitride (SiN) wafer and patterned to construct nanofluidic channels. The patterned parylene layer was directly bonded to another SiN wafer by thermal surface activation and bonding, with a bonding strength of similar to 3 MPa. Fourier transform infrared spectroscopy showed that carbon- oxygen bonds were generated by thermal activation. We demonstrated TEM imaging of gold nanoparticles suspended in liquid using the fabricated nanofluidic chip. | - |
dc.language | English | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.title | Nanofluidic chip for liquid TEM cell fabricated by parylene and silicon nitride direct bonding | - |
dc.type | Article | - |
dc.identifier.wosid | 000408168200001 | - |
dc.identifier.scopusid | 2-s2.0-85028383512 | - |
dc.type.rims | ART | - |
dc.citation.volume | 28 | - |
dc.citation.issue | 37 | - |
dc.citation.beginningpage | 1361 | - |
dc.citation.endingpage | 6528 | - |
dc.citation.publicationname | NANOTECHNOLOGY | - |
dc.identifier.doi | 10.1088/1361-6528/aa8196 | - |
dc.contributor.localauthor | Yoon, Dong Ki | - |
dc.contributor.localauthor | Lee, Wonhee | - |
dc.contributor.nonIdAuthor | Kang, Il-Suk | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | liquid TEM cell | - |
dc.subject.keywordAuthor | wafer bonding | - |
dc.subject.keywordAuthor | parylene | - |
dc.subject.keywordAuthor | thermal activation | - |
dc.subject.keywordPlus | TRANSMISSION ELECTRON-MICROSCOPY | - |
dc.subject.keywordPlus | WET-CELL | - |
dc.subject.keywordPlus | NANOPARTICLES | - |
dc.subject.keywordPlus | PRESSURE | - |
dc.subject.keywordPlus | TEMPERATURE | - |
dc.subject.keywordPlus | PLATFORM | - |
dc.subject.keywordPlus | PLASMA | - |
dc.subject.keywordPlus | SYSTEM | - |
dc.subject.keywordPlus | FILMS | - |
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