Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Hyeong-Gi | ko |
| dc.contributor.author | Choi, Yong-Won | ko |
| dc.contributor.author | Shin, Ji-won | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2017-08-03T01:41:13Z | - |
| dc.date.available | 2017-08-03T01:41:13Z | - |
| dc.date.created | 2015-07-30 | - |
| dc.date.created | 2015-07-30 | - |
| dc.date.created | 2015-07-30 | - |
| dc.date.issued | 2015-05-27 | - |
| dc.identifier.citation | 65th Electronic Components and Technology Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/225020 | - |
| dc.language | English | - |
| dc.publisher | IEEE Electronic Components and Technology Conference | - |
| dc.title | Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000370285100052 | - |
| dc.identifier.scopusid | 2-s2.0-84942102709 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 65th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Sheraton San Diego Hotel & Marina | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Lee, Hyeong-Gi | - |
| dc.contributor.nonIdAuthor | Choi, Yong-Won | - |
| dc.contributor.nonIdAuthor | Shin, Ji-won | - |
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