Effects of Thermo-compression Bonding Parameters on Joint Formation of Micro-bumps in Non-conductive Film (NCF)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Shin, Ji-Won | ko |
| dc.contributor.author | Kim, Young Soon | ko |
| dc.contributor.author | Lee, Hyoung Gi | ko |
| dc.contributor.author | Kang, Un Byung | ko |
| dc.contributor.author | Seo, Sun Kyung | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2017-08-03T01:14:50Z | - |
| dc.date.available | 2017-08-03T01:14:50Z | - |
| dc.date.created | 2015-07-30 | - |
| dc.date.created | 2015-07-30 | - |
| dc.date.created | 2015-07-30 | - |
| dc.date.issued | 2015-05-28 | - |
| dc.identifier.citation | 65th Electronic Components and Technology Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/225014 | - |
| dc.language | English | - |
| dc.publisher | IEEE Electronic Components and Technology Conference | - |
| dc.title | Effects of Thermo-compression Bonding Parameters on Joint Formation of Micro-bumps in Non-conductive Film (NCF) | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000370285100141 | - |
| dc.identifier.scopusid | 2-s2.0-84942109164 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 65th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Sheraton San Diego Hotel & Marina | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Shin, Ji-Won | - |
| dc.contributor.nonIdAuthor | Kim, Young Soon | - |
| dc.contributor.nonIdAuthor | Lee, Hyoung Gi | - |
| dc.contributor.nonIdAuthor | Kang, Un Byung | - |
| dc.contributor.nonIdAuthor | Seo, Sun Kyung | - |
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