DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jo, Wonhee | ko |
dc.contributor.author | Kang, Hong-Suk | ko |
dc.contributor.author | Choi, Jaeho | ko |
dc.contributor.author | Lee, Hongkyung | ko |
dc.contributor.author | Kim, Hee-Tak | ko |
dc.date.accessioned | 2017-06-16T04:01:18Z | - |
dc.date.available | 2017-06-16T04:01:18Z | - |
dc.date.created | 2017-06-05 | - |
dc.date.created | 2017-06-05 | - |
dc.date.created | 2017-06-05 | - |
dc.date.issued | 2017-05 | - |
dc.identifier.citation | ACS APPLIED MATERIALS & INTERFACES, v.9, no.17, pp.15114 - 15121 | - |
dc.identifier.issn | 1944-8244 | - |
dc.identifier.uri | http://hdl.handle.net/10203/224078 | - |
dc.description.abstract | Silver nanowires. (AgNWs) are one of the most promising materials to replace commercially available indium tin oxide in flexible transparent conductive films (TCFs); however, there are still numerous problems originating from poor AgNW junction formation and improper AgNW embedment into transparent substrates. To mitigate these problems, high-temperature processes have been adopted; however, unwanted substrate deformation prevents the use of these processes for the formation of flexible TCFs. In this work, we present a novel poly(methyl methacrylate) interlayer plasticized by dibutyl phthalate for low-temperature fabrication of AgNW-based TCFs, which does not cause any substrate deformation. By exploiting the viscoelastic properties of the plasticized interlayer near the lowered glass-transition temperature, a monolithic junction of AgNWs on the interlayer and embedment of the interconnected AgNWs into the interlayer are achieved in a single-step pressing. The resulting AgNW-TCFs are highly transparent (similar to 92% at a wavelength of 550 nm), highly conductive (<90 Omega/sq), and environmentally and mechanically robust. Therefore, the plasticized interlayer provides a simple and effective route to fabricate high-quality AgNW-based TCFs. | - |
dc.language | English | - |
dc.publisher | AMER CHEMICAL SOC | - |
dc.title | Plasticized Polymer Interlayer for Low-Temperature Fabrication of a High-Quality Silver Nanowire-Based Flexible Transparent and Conductive Film | - |
dc.type | Article | - |
dc.identifier.wosid | 000400802700063 | - |
dc.identifier.scopusid | 2-s2.0-85018995195 | - |
dc.type.rims | ART | - |
dc.citation.volume | 9 | - |
dc.citation.issue | 17 | - |
dc.citation.beginningpage | 15114 | - |
dc.citation.endingpage | 15121 | - |
dc.citation.publicationname | ACS APPLIED MATERIALS & INTERFACES | - |
dc.identifier.doi | 10.1021/acsami.7b01344 | - |
dc.contributor.localauthor | Kim, Hee-Tak | - |
dc.contributor.nonIdAuthor | Jo, Wonhee | - |
dc.contributor.nonIdAuthor | Kang, Hong-Suk | - |
dc.contributor.nonIdAuthor | Choi, Jaeho | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | flexible transparent conductive film | - |
dc.subject.keywordAuthor | silver nanowire | - |
dc.subject.keywordAuthor | plasticized interlayer | - |
dc.subject.keywordAuthor | viscoelastieity | - |
dc.subject.keywordAuthor | monolithic junction | - |
dc.subject.keywordPlus | METAL-ELECTRODE | - |
dc.subject.keywordPlus | NEXT-GENERATION | - |
dc.subject.keywordPlus | SUBSTRATE | - |
dc.subject.keywordPlus | GRAPHENE | - |
dc.subject.keywordPlus | NETWORKS | - |
dc.subject.keywordPlus | NANOPARTICLES | - |
dc.subject.keywordPlus | ENCAPSULATION | - |
dc.subject.keywordPlus | DEPOSITION | - |
dc.subject.keywordPlus | ADHESION | - |
dc.subject.keywordPlus | CONTACT | - |
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