A study on the novel Nylon Anchoring Polymer Layer(APL) Anisotropic Conductive Films(ACFs) for Ultra Fine pitch Chip-on-Glass(COG) applications

Abstract

In this study, Nylon APL has been introduced into the ACFs system. Then, the effects of Nylon APL ACFs properties on conductive particle movement and interconnection stability of ultra fine pitch COG applications were investigated. The APL structure can not only significantly suppress the particles movement in ultra-fine pitch COG applications, but also prevent short circuit formation. After ACFs bonding process, the percentage of captured conductive particles of the conventional ACFs was 33%, however, that of Nylon APL ACFs showed 90%. In addition, the Nylon APL ACFs showed excellent electrical properties such as stable contact resistance without any open or short circuits.