DC Field | Value | Language |
---|---|---|
dc.contributor.author | 하헌우 | ko |
dc.contributor.author | 강수진 | ko |
dc.contributor.author | 김태홍 | ko |
dc.contributor.author | 오현웅 | ko |
dc.date.accessioned | 2017-04-14T08:16:27Z | - |
dc.date.available | 2017-04-14T08:16:27Z | - |
dc.date.created | 2017-04-05 | - |
dc.date.created | 2017-04-05 | - |
dc.date.issued | 2016-12 | - |
dc.identifier.citation | 항공우주시스템공학회지, v.10, no.2, pp.1 - 6 | - |
dc.identifier.issn | 1976-6300 | - |
dc.identifier.uri | http://hdl.handle.net/10203/223121 | - |
dc.description.abstract | The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature. | - |
dc.language | Korean | - |
dc.publisher | 항공우주시스템공학회 | - |
dc.subject | Thermal Analysis | - |
dc.subject | Electronic Equipment | - |
dc.subject | EEE(Electric | - |
dc.subject | Electronic and Electro-mechanical) Parts | - |
dc.subject | Junction Temperature | - |
dc.title | 위성 데이터 전송용 2축 짐벌식 X-band 안테나 구동용 전장품 APD 열 해석 | - |
dc.title.alternative | Thermal Analysis of APD Electronics for Activation of a Spaceborne X-band 2-axis Antenna | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.citation.volume | 10 | - |
dc.citation.issue | 2 | - |
dc.citation.beginningpage | 1 | - |
dc.citation.endingpage | 6 | - |
dc.citation.publicationname | 항공우주시스템공학회지 | - |
dc.identifier.doi | 10.20910/JASE.2016.10.2.1 | - |
dc.identifier.kciid | ART002117740 | - |
dc.contributor.nonIdAuthor | 강수진 | - |
dc.contributor.nonIdAuthor | 김태홍 | - |
dc.contributor.nonIdAuthor | 오현웅 | - |
dc.description.isOpenAccess | N | - |
dc.subject.keywordAuthor | Thermal Analysis | - |
dc.subject.keywordAuthor | Electronic Equipment | - |
dc.subject.keywordAuthor | EEE(Electric | - |
dc.subject.keywordAuthor | Electronic and Electro-mechanical) Parts | - |
dc.subject.keywordAuthor | Junction Temperature | - |
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