Ultrathin adhesive film development via initiated chemical vapor deposition

Abstract

Along with the scaling down of various applications such as microfluidics and electronic devices, adhesive film also need to be scale down, with high controllability and stability. Various method is reported to achieve strong adhesion, still has problems about process time, systematic limitation, and thickness control. In this study, thin adhesive layer is developed via initiated chemical vapor deposition (iCVD). Poly(glycidyl methacrylate) (pGMA) and poly(2-(dimethylamino)ethyl methacrylate) (pDMAEMA) are deposited on the substrate, and ring opening reaction which is very well known as a strong adhesion, is achieved in hundred nanometer scales. Every polymer film is deposited with one system, iCVD, in mild condition. With this adhesive system, strong adhesion strength near to $300 N/cm^{2}$ has been achieved, with high resistive to organic solvents and high temperature. With the new material selection, process time is dramatically shortened compared to previous works. Proper optical properties are confirmed for the compatibility for optical devices. For the application, lamination of encapsulation layer using iCVD adhesive film is performed, and achieved $2.94x10^{-2} g m^{-2} day^{-1}$ value of water vapor transmission rate