DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Sang Hoon | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2017-02-02T02:27:09Z | - |
dc.date.available | 2017-02-02T02:27:09Z | - |
dc.date.created | 2017-01-23 | - |
dc.date.created | 2017-01-23 | - |
dc.date.issued | 2017-01 | - |
dc.identifier.citation | JOURNAL OF ELECTRONIC MATERIALS, v.46, no.1, pp.167 - 174 | - |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | http://hdl.handle.net/10203/220388 | - |
dc.description.abstract | Nanofiber-sheet anisotropic conductive films (NS-ACFs) were invented to overcome the limitations of high joint resistance and short-circuit issues of ultra-fine-pitch interconnections. The NS-ACFs have great advantages in terms of suppressing conductive particle movement during the flip-chip bonding process. In a 20-mu m ultra-fine-pitch with 7-mu m bump spacing ultrafine-pitch chip-on-glass assembly, suppression effects of conductive particle movement were significantly improved by using the NS-ACFs because an unmelted NS inside the ACFs suppressed the mobility of conductive particles so that they would not flow out during the bonding process. The NS-ACFs could significantly increase the capture rate of conductive particles from 31% up to 81% compared to conventional ACFs. Moreover, excellent electrical contact properties were obtained without melting the nanofiber material which was essential for the conventional nanofiber ACFs. The NS-ACFs are promising interconnection materials for ultra-fine-pitch packaging applications. | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.subject | ADHESIVES ACAS | - |
dc.subject | RELIABILITY | - |
dc.subject | TECHNOLOGY | - |
dc.title | A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications | - |
dc.type | Article | - |
dc.identifier.wosid | 000391126900021 | - |
dc.identifier.scopusid | 2-s2.0-84986292154 | - |
dc.type.rims | ART | - |
dc.citation.volume | 46 | - |
dc.citation.issue | 1 | - |
dc.citation.beginningpage | 167 | - |
dc.citation.endingpage | 174 | - |
dc.citation.publicationname | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.identifier.doi | 10.1007/s11664-016-4895-5 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Nanofiber-sheet (NS) | - |
dc.subject.keywordAuthor | nanofiber | - |
dc.subject.keywordAuthor | electrospinning | - |
dc.subject.keywordAuthor | anisotropic conductive films (ACFs) | - |
dc.subject.keywordAuthor | ultra-fine-pitch interconnection | - |
dc.subject.keywordAuthor | plasma etching | - |
dc.subject.keywordPlus | ADHESIVES ACAS | - |
dc.subject.keywordPlus | RELIABILITY | - |
dc.subject.keywordPlus | TECHNOLOGY | - |
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