Investigation of resistive probes with high sensitivity

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Novel fabrication methods are investigated to enhance the sensitivity of resistive probes. In this paper, two new silicon resistive probes are presented by using two-dimensional device simulation (SILVACO™). Enhancement probe and 1-MOS probe are formed by using anisotropic etch and mask transcription process. Due to novel structures, the sensitivity of resistive probes is increased dramatically.
Publisher
IEEE
Issue Date
2008
Language
English
Citation

Silicon Nanoelectronics Workshop

ISSN
2161-4636
DOI
10.1109/SNW.2008.5418407
URI
http://hdl.handle.net/10203/220290
Appears in Collection
MS-Journal Papers(저널논문)
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