Fabrication of the Packaging-Completed Flexible Si-based Device Using Flip-Chip Bonding Technology
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Do Hyun | - |
| dc.contributor.author | Yoo, Hyeon Gyun | - |
| dc.contributor.author | Lee, Keon Jae | - |
| dc.date.accessioned | 2017-01-18T05:24:16Z | - |
| dc.date.available | 2017-01-18T05:24:16Z | - |
| dc.date.created | 2017-01-09 | - |
| dc.date.issued | 2015-10-30 | - |
| dc.identifier.citation | 2015년 대한금속재료학회 추계학술대회 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/220013 | - |
| dc.language | Korean | - |
| dc.publisher | (사)대한금속 재료학회 | - |
| dc.title | Fabrication of the Packaging-Completed Flexible Si-based Device Using Flip-Chip Bonding Technology | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2015년 대한금속재료학회 추계학술대회 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | 대전 컨벤션센터 | - |
| dc.contributor.localauthor | Kim, Do Hyun | - |
| dc.contributor.localauthor | Yoo, Hyeon Gyun | - |
| dc.contributor.localauthor | Lee, Keon Jae | - |
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