Electrochemical migration and corrosion behavior of IC package substrate under square wave voltage
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Jongsoo | ko |
| dc.contributor.author | Kim, Min Joong | ko |
| dc.contributor.author | Yu, Minkyu | ko |
| dc.contributor.author | Kwon, Hyuk Sang | ko |
| dc.date.accessioned | 2017-01-13T01:24:02Z | - |
| dc.date.available | 2017-01-13T01:24:02Z | - |
| dc.date.created | 2016-12-26 | - |
| dc.date.issued | 2016-01-29 | - |
| dc.identifier.citation | 2016 Asian Pacific Corrosion Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/218610 | - |
| dc.language | English | - |
| dc.publisher | NACE International | - |
| dc.title | Electrochemical migration and corrosion behavior of IC package substrate under square wave voltage | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2016 Asian Pacific Corrosion Conference | - |
| dc.identifier.conferencecountry | II | - |
| dc.identifier.conferencelocation | Victor Menezes Convention Centre, Mumbai | - |
| dc.contributor.localauthor | Kwon, Hyuk Sang | - |
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