Vertically Integrated Nanowire-Based Unified Memory

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dc.contributor.authorLee, Byung-Hyunko
dc.contributor.authorAhn, Dae-Chulko
dc.contributor.authorKang, Min-Hoko
dc.contributor.authorJeon, Seung-Baeko
dc.contributor.authorChoi, Yang-Kyuko
dc.date.accessioned2016-11-09T05:29:53Z-
dc.date.available2016-11-09T05:29:53Z-
dc.date.created2016-10-19-
dc.date.created2016-10-19-
dc.date.issued2016-09-
dc.identifier.citationNANO LETTERS, v.16, no.9, pp.5909 - 5916-
dc.identifier.issn1530-6984-
dc.identifier.urihttp://hdl.handle.net/10203/213773-
dc.description.abstractA vertically integrated nanowire-based device for multifunctional Unified, memory that combine dynamic random access memory (DRAM) and flash memory,,in a single transistor is demonstrated for the first time. The:device Utilizes a gate-all-around (GAA) structure that completely surrounds the nano-wire; the structure is built on a-bulk silicon wafer. A vertically integrated unified memory (VIUM) device composed of five-story channels was fabricated via the one-route all-dry etching process (ORADEP) reliable reproducibility, stiction-free stability, and high-uniformity. In each DRAM and flash memory operation, the five-story VIUM showed a remarkably enhanced sensing current drivability compared with one-story unified-memory (UM) characteristics. In addition-to-each independent memory mode, the switching endurance of the VIUM was evaluated in the unified mode, which alternatively activates two memory modes, resulting in an even higher sensing Memory window-than that of the UM. In addition to our previous work on a logic transistor joining high performance with good scalability this work describes a novel memory hierarchy design with high functionality for system-on-chip (SoC) architectures, demonstrating the practicality and versatility of the vertically integrated nanowire configuration for use in various applications-
dc.languageEnglish-
dc.publisherAMER CHEMICAL SOC-
dc.titleVertically Integrated Nanowire-Based Unified Memory-
dc.typeArticle-
dc.identifier.wosid000383412100087-
dc.identifier.scopusid2-s2.0-84987748089-
dc.type.rimsART-
dc.citation.volume16-
dc.citation.issue9-
dc.citation.beginningpage5909-
dc.citation.endingpage5916-
dc.citation.publicationnameNANO LETTERS-
dc.identifier.doi10.1021/acs.nanolett.6b02824-
dc.contributor.localauthorChoi, Yang-Kyu-
dc.contributor.nonIdAuthorAhn, Dae-Chul-
dc.contributor.nonIdAuthorKang, Min-Ho-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorVertically integrated nanowire-
dc.subject.keywordAuthorzRAM-
dc.subject.keywordAuthor1T-DRAM-
dc.subject.keywordAuthorNAND flash memory-
dc.subject.keywordAuthorunified memory-
dc.subject.keywordAuthorOne-route all-dry etching process-
dc.subject.keywordPlusRAM URAM-
dc.subject.keywordPlusTRANSISTORS-
dc.subject.keywordPlusTECHNOLOGY-
dc.subject.keywordPlusFUTURE-
dc.subject.keywordPlusDEVICE-
dc.subject.keywordPlusCELL-
dc.subject.keywordPlus1T-DRAM-
dc.subject.keywordPlusLIMITS-
dc.subject.keywordPlusNVM-
dc.subject.keywordPlusNM-
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