유연/신축성 전자패키징 용 폴리머 재료의 기계적 물성 측정 기술 리뷰Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김철규 | ko |
| dc.contributor.author | 이태익 | ko |
| dc.contributor.author | 김택수 | ko |
| dc.date.accessioned | 2016-11-09T04:47:02Z | - |
| dc.date.available | 2016-11-09T04:47:02Z | - |
| dc.date.created | 2016-10-12 | - |
| dc.date.created | 2016-10-12 | - |
| dc.date.issued | 2016-06 | - |
| dc.identifier.citation | 마이크로전자 및 패키징학회지, v.23, no.2, pp.19 - 28 | - |
| dc.identifier.issn | 1226-9360 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/213623 | - |
| dc.language | Korean | - |
| dc.publisher | 한국마이크로전자및패키징학회 | - |
| dc.title | 유연/신축성 전자패키징 용 폴리머 재료의 기계적 물성 측정 기술 리뷰 | - |
| dc.title.alternative | Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 23 | - |
| dc.citation.issue | 2 | - |
| dc.citation.beginningpage | 19 | - |
| dc.citation.endingpage | 28 | - |
| dc.citation.publicationname | 마이크로전자 및 패키징학회지 | - |
| dc.identifier.doi | 10.6117/kmeps.2016.23.2.019 | - |
| dc.identifier.kciid | ART002124916 | - |
| dc.contributor.localauthor | 김택수 | - |
| dc.subject.keywordAuthor | Flexible electronics | - |
| dc.subject.keywordAuthor | Stretchable electronics | - |
| dc.subject.keywordAuthor | Polymer | - |
| dc.subject.keywordAuthor | Mechanical properties | - |
| dc.subject.keywordAuthor | Measurement technology | - |
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- ME-Journal Papers(저널논문)
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