Current Status and Forecast on Development of Metal Matrix Composites for Electronic Packaging Applications

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dc.contributor.authorLee, HS-
dc.contributor.author홍순형-
dc.date.accessioned2016-11-09T02:13:03Z-
dc.date.available2016-11-09T02:13:03Z-
dc.date.created2016-08-29-
dc.date.issued2001-10-26-
dc.identifier.citation2nd Symposium on Composite Materials in Korean Institute of Metals and Materials-
dc.identifier.urihttp://hdl.handle.net/10203/213472-
dc.languageKorean-
dc.publisher2nd Symposium on Composite Materials in Korean Institute of Metals and Materials-
dc.titleCurrent Status and Forecast on Development of Metal Matrix Composites for Electronic Packaging Applications-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname2nd Symposium on Composite Materials in Korean Institute of Metals and Materials-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocation고려대학교-
dc.contributor.localauthor홍순형-
dc.contributor.nonIdAuthorLee, HS-
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MS-Conference Papers(학술회의논문)
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