The Influence of Sequence Plasma Treatment Conditions on Peel Strength of Cu-Ni Clad in SAB (Surface Activated Bonding)
- Publisher
- 대한금속재료학회
- Issue Date
- 2010-04-22
- Language
- Korean
- Citation
Meeting of the Korean Institute of Metals and Materials, pp.135 - 135
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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