Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints ReliabilityEffects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Zhang, Shuye | ko |
| dc.contributor.author | Paik, Kyung Wook | ko |
| dc.date.accessioned | 2016-07-06T04:36:46Z | - |
| dc.date.available | 2016-07-06T04:36:46Z | - |
| dc.date.created | 2016-06-15 | - |
| dc.date.created | 2016-06-15 | - |
| dc.date.issued | 2016-06-02 | - |
| dc.identifier.citation | IEEE 66th Electronic Components and Technology Conference, pp.737 - 742 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/209588 | - |
| dc.description.abstract | The effects of cooling processes of the hot bar lift-up time and the silica filler content of solder ACFs polymer resin on the crack formation at SnBi58 solder ACFs joint were investigated to obtain higher solder ACFs joint reliability. As a summary, complete removal of the solder crack at acrylic based ACF joints could be obtained by delaying hot bar lift-up time, until the temperature was cooled below the glass transition temperature of acrylic resin during cooling process, or adding more than 10 wt% of silica filler content into acrylic resins. Moreover, very reliable solder joint morphology and stable joint contact resistance were obtained after 1000 cycles T/C reliability due to removing solder cracks completely. | - |
| dc.language | English | - |
| dc.publisher | IEEE 66th Electronic Components and Technology Conference | - |
| dc.title | Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability | - |
| dc.title.alternative | Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000386103500109 | - |
| dc.identifier.scopusid | 2-s2.0-84987827443 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 737 | - |
| dc.citation.endingpage | 742 | - |
| dc.citation.publicationname | IEEE 66th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Cosmopolitan Hotel of Las Vegas | - |
| dc.identifier.doi | 10.1109/ECTC.2016.152 | - |
| dc.contributor.localauthor | Paik, Kyung Wook | - |
| dc.contributor.nonIdAuthor | Zhang, Shuye | - |
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