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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Journal Papers(저널논문)

Investigation of sputter-deposited Al-2at.%Cu layers by means of the tomographic atom probe (TAP)

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dc.contributor.authorChoi, Pyuck-Pako
dc.contributor.authorAl-Kassab, Talaatko
dc.contributor.authorKirchheim, Reinerko
dc.date.accessioned2016-05-10T08:33:08Z-
dc.date.available2016-05-10T08:33:08Z-
dc.date.created2016-02-11-
dc.date.created2016-02-11-
dc.date.issued2005-08-
dc.identifier.citationSCRIPTA MATERIALIA, v.53, no.3, pp.323 - 327-
dc.identifier.issn1359-6462-
dc.identifier.urihttp://hdl.handle.net/10203/207137-
dc.description.abstractSputter-deposited Al-2at.%Cu layers have been investigated with respect to their microstructure and the spatial distribution of the elements using the tomographic atom probe. Al grains show columnar shape in the as-sputtered state, where the matrix is supersaturated with Cu. Upon annealing at temperatures between 150 and 350 degrees C, a significant decrease in the average Cu concentration is measured within the grains. Neither second phase formation within the Al matrix nor Cu enrichment at the surface or at the layer/ substrate interface have been detected, suggesting segregation of Cu atoms in Al grain boundaries. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.-
dc.languageEnglish-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.subjectCU THIN-FILMS-
dc.subjectAL-CU-
dc.subjectPRECIPITATION-
dc.subjectELECTROMIGRATION-
dc.subjectALUMINUM-
dc.subjectCOPPER-
dc.subjectDISSOLUTION-
dc.subjectSEGREGATION-
dc.subjectDIFFUSION-
dc.subjectKINETICS-
dc.titleInvestigation of sputter-deposited Al-2at.%Cu layers by means of the tomographic atom probe (TAP)-
dc.typeArticle-
dc.identifier.wosid000229958500011-
dc.identifier.scopusid2-s2.0-18844435727-
dc.type.rimsART-
dc.citation.volume53-
dc.citation.issue3-
dc.citation.beginningpage323-
dc.citation.endingpage327-
dc.citation.publicationnameSCRIPTA MATERIALIA-
dc.identifier.doi10.1016/j.scriptamat.2005.04.008-
dc.contributor.localauthorChoi, Pyuck-Pa-
dc.contributor.nonIdAuthorAl-Kassab, Talaat-
dc.contributor.nonIdAuthorKirchheim, Reiner-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorAl-Cu alloys-
dc.subject.keywordAuthorsputtering-
dc.subject.keywordAuthornanocrystalline materials-
dc.subject.keywordAuthorgrain boundary segregation-
dc.subject.keywordAuthoratom-probe field-ion microscopy (AP-FIM)-
dc.subject.keywordPlusCU THIN-FILMS-
dc.subject.keywordPlusAL-CU-
dc.subject.keywordPlusPRECIPITATION-
dc.subject.keywordPlusELECTROMIGRATION-
dc.subject.keywordPlusALUMINUM-
dc.subject.keywordPlusCOPPER-
dc.subject.keywordPlusDISSOLUTION-
dc.subject.keywordPlusSEGREGATION-
dc.subject.keywordPlusDIFFUSION-
dc.subject.keywordPlusKINETICS-
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