A 79pJ/b 80Mb/s full-duplex transceiver and a 42.5μW 100kb/s super-regenerative transceiver for body channel communication

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dc.contributor.authorCho, Hyunwooko
dc.contributor.authorYoo, Hoi-Junko
dc.contributor.authorKim, Hyunkiko
dc.contributor.authorKim, Minseoko
dc.contributor.authorJang, Jaeeunko
dc.contributor.authorBae, Joonsungko
dc.date.accessioned2016-04-18T05:20:59Z-
dc.date.available2016-04-18T05:20:59Z-
dc.date.created2015-11-18-
dc.date.created2015-11-18-
dc.date.created2015-11-18-
dc.date.created2015-11-18-
dc.date.created2015-11-18-
dc.date.issued2015-02-25-
dc.identifier.citation62nd IEEE International Solid-State Circuits Conference (ISSCC), pp.380 - 381-
dc.identifier.issn0193-6530-
dc.identifier.urihttp://hdl.handle.net/10203/204563-
dc.description.abstractRecently, smart phones or head-mounted displays enables high definition (HD) video streaming and image data to be shared with friends while wearable smart sensors continuously monitor and send user's physiological information to a smart watch. Body channel communication (BCC), which uses the human body as the communication channel [1], has demonstrated better human-friendly interface and energy-efficient performance compared with air channel communication. However, most of the previous BCC research used only the frequency band below 100MHz and were only focused on either low data rate (<10Mb/s) healthcare applications [2-5] or high data rate (60Mb/s) multimedia data transfer [6]. Its available channel bandwidth was limited < 100MHz and the interference from FM radio due to body antenna effect had a significant effect on its performance. Moreover, [6] did not support full duplex communication so that the user interaction with wearable devices was not possible in live video streaming or real-time VR game applications.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleA 79pJ/b 80Mb/s full-duplex transceiver and a 42.5μW 100kb/s super-regenerative transceiver for body channel communication-
dc.typeConference-
dc.identifier.wosid000355252700160-
dc.identifier.scopusid2-s2.0-84940764757-
dc.type.rimsCONF-
dc.citation.beginningpage380-
dc.citation.endingpage381-
dc.citation.publicationname62nd IEEE International Solid-State Circuits Conference (ISSCC)-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSan Francisco Marriott-
dc.identifier.doi10.1109/ISSCC.2015.7063085-
dc.contributor.localauthorYoo, Hoi-Jun-
dc.contributor.nonIdAuthorBae, Joonsung-
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EE-Conference Papers(학술회의논문)
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