Cu-Ag Core-Shell Nanoparticles as Conductive Ink Material for Printed Electronics Application
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Changsoo | ko |
| dc.contributor.author | Kim, Narae | ko |
| dc.contributor.author | Koo, Jahyun | ko |
| dc.contributor.author | Lee, Yung Jong | ko |
| dc.contributor.author | Lee, Hyuck-Mo | ko |
| dc.date.accessioned | 2016-04-12T08:34:48Z | - |
| dc.date.available | 2016-04-12T08:34:48Z | - |
| dc.date.created | 2015-11-10 | - |
| dc.date.issued | 2015-03-18 | - |
| dc.identifier.citation | 2015 TMS annual meeting(144th) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/203650 | - |
| dc.language | English | - |
| dc.publisher | The Minerals, Metals & Materials Society | - |
| dc.title | Cu-Ag Core-Shell Nanoparticles as Conductive Ink Material for Printed Electronics Application | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2015 TMS annual meeting(144th) | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Walt Disney World, Orlando | - |
| dc.contributor.localauthor | Lee, Hyuck-Mo | - |
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