Design and Analysis of Magnetically Coupled Coil Structures for PCB-to-Active Interposer Wireless Power Transfer in 2.5D/3D-IC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joungho | ko |
| dc.date.accessioned | 2016-04-12T08:04:16Z | - |
| dc.date.available | 2016-04-12T08:04:16Z | - |
| dc.date.created | 2015-10-06 | - |
| dc.date.created | 2015-10-06 | - |
| dc.date.created | 2015-10-06 | - |
| dc.date.issued | 2014-12-15 | - |
| dc.identifier.citation | IEEE Electrical Design of Advanced Packaging & System Symposium | - |
| dc.identifier.uri | http://hdl.handle.net/10203/203471 | - |
| dc.language | English | - |
| dc.publisher | IEEE Electrical Design of Advanced Packaging & System Symposium | - |
| dc.title | Design and Analysis of Magnetically Coupled Coil Structures for PCB-to-Active Interposer Wireless Power Transfer in 2.5D/3D-IC | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000380498800001 | - |
| dc.identifier.scopusid | 2-s2.0-84936083625 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | IEEE Electrical Design of Advanced Packaging & System Symposium | - |
| dc.identifier.conferencecountry | II | - |
| dc.identifier.conferencelocation | World Trade Center Brigade Gateway | - |
| dc.contributor.localauthor | Kim, Joungho | - |
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