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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Signal Integrity Design of Bump-less Interconnection for High-speed Signaling in 2.5D and 3D IC

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dc.contributor.authorKim, Jounghoko
dc.contributor.authorKim, Heegonko
dc.contributor.authorChoi, Suminko
dc.contributor.authorKim, Dong-Hyunko
dc.contributor.authorCho, Kyungjunko
dc.date.accessioned2016-04-12T08:03:44Z-
dc.date.available2016-04-12T08:03:44Z-
dc.date.created2015-10-12-
dc.date.created2015-10-12-
dc.date.created2015-10-12-
dc.date.issued2015-05-26-
dc.identifier.citation2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)-
dc.identifier.urihttp://hdl.handle.net/10203/203466-
dc.languageEnglish-
dc.publisher2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)-
dc.titleSignal Integrity Design of Bump-less Interconnection for High-speed Signaling in 2.5D and 3D IC-
dc.typeConference-
dc.identifier.wosid000380499800170-
dc.identifier.scopusid2-s2.0-84964078212-
dc.type.rimsCONF-
dc.citation.publicationname2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)-
dc.identifier.conferencecountryCH-
dc.identifier.conferencelocationThe Grand Hotel, Taipei, Taiwan-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorKim, Heegon-
dc.contributor.nonIdAuthorChoi, Sumin-
dc.contributor.nonIdAuthorKim, Dong-Hyun-
dc.contributor.nonIdAuthorCho, Kyungjun-
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EE-Conference Papers(학술회의논문)
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