Browse "RIMS Conference Papers" by Author Henderson D.W.

Showing results 2 to 2 of 2

2
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents

Kang S.K.; Lauro P.; Shih D.-Y.; Henderson D.W.; Gosselin T.; Bartelo J.; Cain S.R.; et al, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.661 - 667, 2004-06-01

rss_1.0 rss_2.0 atom_1.0