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Plasma-enhanced atomic layer deposition of Ta(C)N thin films for copper diffusion barrier

Kim K.H.; Seong-Jun Jeong; Yoon J.S.; Kim Y.M.; Kwon S.H., 5th Symposium on Atomic Layer Deposition - 216th Meeting of the Electrochemical Society, v.25, pp.301 - 308, 2009-10-05

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