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Three-tier 3D ICs for more power reduction: Strategies in CAD, design, and bonding selection

Song, Taigon; Panth, Shreepad; Chae, Yoo-Jin; Lim, Sung Kyu, 34th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2015, pp.752 - 757, ACM SIGDA and IEEE CEDA, 2015-11

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