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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Low Temperature Two-Step Atomic Layer Deposition of Tantalum Nitride for Cu Diffusion Barrier Kwon J.-D.; Jeong S.-J.; Kang J.-W.; Kim D.-G.; Kim J.-K.; Rha J.-J.; Nam K.-S.; Kwon S.-H., JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.156, no.11, pp.H832 - H835, 2009 | |
Direct observation of individual Barkhausen avalanches in nucleation-mediated magnetization reversal processes Im, Mi-Young; Fischer, Peter; Kim, Dong-Hyun; Shin, Sung-Chul, APPLIED PHYSICS LETTERS, v.95, no.18, 2009-11 | |
Large Exchange Bias due to the Spin Density Wave Antiferromagnet Cr in a Fe/Cr(100) Bilayer Kim, Ki-Yeon; Shin, Sung-Chul; Hwang, Yo-Sun; Jo, Younghun; Angappane, S, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.54, pp.175 - 179, 2009-01 |
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