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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Low-Temperature Material Stacking of Ultrathin Body Ge (110)-on-Insulator Structure via Wafer Bonding and Epitaxial Liftoff From III-V Templates Shim, Jae-Phil; Kim, Han-Sung; Ju, Gunwu; Lim, Hyeong-Rak; Kim, Seong Kwang; Han, Jae-Hoon; Kim, Hyung-Jun; Kim, Sang-Hyeon, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.65, no.3, pp.1253 - 1257, 2018-03 | |
| Heterogeneous Integration Toward a Monolithic 3-D Chip Enabled by III-V and Ge Materials Kim, Sang-Hyeon; Kim, Seong-Kwang; Shim, Jae-Phil; Geum, Dae-Myeong; Ju, Gunwu; Kim, Han-Sung; Lim, Hee-Jeong; Lim, Hyeong-Rak; Han, Jae-Hoon; Lee, Subin; Kim, Ho-Sung; Bidenko, Pavlo; Kang, Chang-Mo; Lee, Dong-Seon; Song, Jin-Dong; Choi, Won Jun; Kim, Hyung-Jun, IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, v.6, no.1, pp.579 - 587, 2018 | |
| Verification of Ge-on-insulator structure for a mid-infrared photonics platform Kim, SangHyeon; Han, Jae-Hoon; Shim, Jae-Phil; Kim, Hyung-Jun; Choi, Won Jun, OPTICAL MATERIALS EXPRESS, v.8, no.2, pp.440 - 451, 2018-02 |
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