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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| EFFECTS OF THE DEPOSITION TEMPERATURE ON THE RESISTIVITY OF COPPER-FILMS PRODUCED BY LOW-PRESSURE METAL-ORGANIC CHEMICAL-VAPOR-DEPOSITION ON A TIN BARRIER LAYER Chun , Soung Soon, JOURNAL OF MATERIALS SCIENCE, v.30, no.8, pp.2029 - 2034, 1995 |
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