Showing results 1 to 3 of 3
Direct imprinting of thermally reduced silver nanoparticles via deformation-driven ink injection for high-performance, flexible metal grid embedded transparent conductors Oh, Yong Suk; Choi, Dong Yun; Sung, Hyung Jin, RSC ADVANCES, v.5, no.79, pp.64661 - 64668, 2015-07 |
High-Performance, Solution-Processed, Embedded Multiscale Metallic Transparent Conductors Oh, Yong Suk; Lee, Hyunwoo; Choi, Dong Yun; Lee, Sung-Uk; Kim, Hojin; Yoo, Seunghyup; Park, Inkyu; et al, ACS APPLIED MATERIALS & INTERFACES, v.8, no.17, pp.10937 - 10945, 2016-05 |
Room-Temperature Nanosoldering of a Very Long Metal Nanowire Network by Conducting-Polymer-Assisted Joining for a Flexible Touch-Panel Application Lee, Jinhwan; Lee, Phillip; Lee, Ha Beom; Hong, Sukjoon; Lee, Inhwa; Yeo, Junyeob; Lee, Seung Seob; et al, ADVANCED FUNCTIONAL MATERIALS, v.23, no.34, pp.4171 - 4176, 2013-09 |
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