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A simple and novel method for the evaluation of adhesion properties between UV curable resin and stamp in UV-nanoimprint lithography (UV-NIL) Heo, Jung-Chul; Kim, Kwang-Seop; Kim, Kyung-Woong, MICROELECTRONIC ENGINEERING, v.98, pp.64 - 69, 2012-10 |
UV-나노임프린트 리소그래피에서의 점착 및 잔류층 두께 측정에 관한 연구 = A study on adhesion characteristics and measurement of residual layer thickness in UV-nanoimprint lithographylink 허정철; Heo, Jung-Chul; et al, 한국과학기술원, 2012 |
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