Browse "School of Mechanical and Aerospace Engineering(기계항공공학부)" by Author Jang T.-Y.
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| Thermosonic flip chip bonding using lateral vibration with anisotropic conductive film (ACF) Jang T.-Y.; Ha C.-W.; Kim, Kyung-Soo, 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, pp.113 - 117, 2009-11-17 |
| Using ultrasonic energy for reducing ACF bonding process time Jang T.-Y.; Yun W.-S.; Kim S.-H.; Kim, Kyung-Soo, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008, 2008-11-04 |
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