Showing results 1 to 1 of 1
Investigation on the Mechanical Reliability of TiN/SiO2 for W Nucleation Processes Lee, Sun Woo; Kim, Dong Jun; Jeon, Jinho; Yun, WonJun; Kim, Tae-Sung; Kim, Taek-Soo, The 19th International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2021-11-05 |
Discover